Yokohama, Japan

Takuroh Kamimura

This inventor holds 34 USPTO granted patents and 7 published patent applications, primarily in Heat Management Technologies. Top assignee: Lenovo (Singapore) Pte. Ltd.. Active years: 2013-2026.

USPTO Granted Patents = 34 

% Patents Active = 91.2

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 37(Granted Patents)


Location History:

  • Fujisawa, JP (2013)
  • Kanagawa-ken, JP (2018 - 2019)
  • Kawasaki, JP (2016 - 2020)
  • Yokohama, JP (2019 - 2024)
  • Kanagawa, JP (2020 - 2024)

Company Filing History:


Years Active: 2013-2026

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Areas of Expertise:
Heat Radiation Component
Electronic Apparatus
Heat Dissipation Structure
Cooling Module
Heat Transport Device
Information Processing Apparatus
Cooling System
Thermal Management
Cooling Device
Power Consumption Control
Fan Device
Portable Information Devices
34 patents (USPTO):Explore Patents

Title: Innovations of Takuroh Kamimura in Heat Dissipation Technology

Introduction

Takuroh Kamimura is an esteemed inventor based in Yokohama, Japan, known for his significant contributions to the field of electronic apparatus heat dissipation. With an impressive portfolio of 29 patents, Kamimura continues to push the boundaries of innovation in technology. His work primarily focuses on enhancing the efficiency of heat management systems in electronic devices.

Latest Patents

Among Kamimura's latest patents are groundbreaking technologies that improve thermal management in electronic devices. One of his notable inventions is a heat pipe design for electronic apparatuses. This patent describes an electronic apparatus that includes a heating element and several heat pipes thermally connected to it. Each heat pipe features a rectangular cross-section, with heat receiving surfaces efficiently linked to the heating element. Notably, adjacent heat pipes are in surface contact to optimize heat transfer.

Another key patent involves a heat dissipation structure specifically designed for heat-generating electric components. This innovative structure comprises a heat dissipator positioned along the component's surface and a porous material nestled between the electric component and the heat dissipator. The porous material is specially designed to be impregnated with a heat-transfer fluid, which can encompass liquid metal, thereby enhancing the device's thermal management capabilities.

Career Highlights

Kamimura currently works with Lenovo (Singapore) Pte. Ltd., where he continues to make strides in innovation. His work at Lenovo involves collaborating with cutting-edge technologies, particularly focusing on creating efficient thermal management systems that are essential for modern electronic devices. His dedication to research and development has made him a respected figure in the field of electronics engineering.

Collaborations

Throughout his career, Takuroh Kamimura has collaborated with talented colleagues, including Akinori Uchino and Masahiro Kitamura. These collaborations have undoubtedly contributed to the robust advancement of Kamimura's projects and innovations, promoting a dynamic exchange of ideas that is vital in the fast-evolving tech industry.

Conclusion

Takuroh Kamimura exemplifies the spirit of innovation in heat dissipation technology. His significant contributions to patents enhance the efficiency of electronic devices, establishing him as a key player in the industry. As technology continues to advance, Kamimura's inventions will play a crucial role in addressing the challenges of heat management in increasingly compact and powerful electronic components.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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