The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Nov. 09, 2022
Applicant:
Lenovo (Singapore) Pte. Ltd., Singapore, SG;
Inventors:
Masahiro Kitamura, Kanagawa, JP;
Takuroh Kamimura, Kanagawa, JP;
Junki Hashiba, Kanagawa, JP;
Takateru Adachi, Kanagawa, JP;
Assignee:
Lenovo (Singapore) Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3736 (2013.01); H01L 23/367 (2013.01); H01L 23/42 (2013.01); H05K 1/0203 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/26 (2013.01); H01L 2224/26125 (2013.01); H01L 2224/29105 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83447 (2013.01);
Abstract
A heat dissipation structure of an electric component that generates heat includes: a heat dissipator provided along a surface of the electric component; a liquid metal interposed between the electric component and the heat dissipator; and a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal.