Lenovo (singapore) Pte. Ltd.

Takuroh Kamimura

Akinori Uchino

Masahiro Kitamura

Atsunobu Nakamura

Ryota Watanabe

Shogo Akiyama

Atsushi Ohyama

Tsutomu Chonan

Takateru Adachi

Kazuhiro Kosugi

Hajime Yoshizawa

Hiroshi Yamazaki

Hiroaki Agata

Satoshi Douzono

Kazuya Tatsuno

Junki Hashiba

Hiroki Oda

Yuhsaku Sugai

Tomoaki Kosugi

Kazuo Fujii

Eiji Shinohara

Takayuki Morino

Yoshiyuki Shibayama

Kenji Watamura

Masayuki Amano

Hideshi Tsukamoto

Yuichiro Seto

Shusaku Tomizawa

Yusaku Morishige

Takanori Hoshino

Hiroyuki Uchida

Ke Ma

Mizuki Itoyama

Yusuke Onoue

Junrong Zhou

Chin Kai Lee

A heat radiation structure includes a vapor chamber provided along a surface of a die, a mesh interposed between the die and the vapor chamber, and a liquid metal impregnated in the mesh. In the mesh, a peripheral portion has a higher material density per unit volume than a central portion. In the mesh, the central portion may be formed of a single layer, and the peripheral portion is formed of two layers. The mesh may be a resin material.

Heat radiation structure and electronic apparatus

An electronic apparatus includes: a heating element; and a plurality of heat pipes that is thermally connected to the heating element. Each of the heat pipes has a cross section having a rectangular shape, a heat receiving surface thermally connected to the heating element, and a side surface orthogonal to the heat receiving surface. The side surfaces of the heat pipes, which are adjacent to each other, are in surface contact with each other.

Heat pipes of an electronic apparatus and method of manufacturing the same

A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.

Heat dissipation structure, method for manufacturing heat dissipation structure, and electronic apparatus

An information processing apparatus includes: a processor with variable rated power; and a power control unit which controls power consumption of the processor. When processing based on a specific application as an application program to implement a specific function is executed in foreground, the power control unit sets rated power corresponding to at least the specific function.

Information processing apparatus and control method

A heat dissipation structure of an electric component that generates heat includes: a heat dissipator provided along a surface of the electric component; a liquid metal interposed between the electric component and the heat dissipator; and a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal.

Heat dissipation structure, manufacturing method for heat dissipation structure, and electronic apparatus

An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.

Electronic apparatus and cooling module

An information processing apparatus includes: a controller that outputs notification information based on input information; and a processor that functions as a system processing unit that executes system processing based on an operating system (OS) and a Basic Input Output System (BIOS) processing unit that executes control related to the performance of the system processing by control of a BIOS using the notification information output from the controller.

Information processing apparatus and control method detecting a specific key combination pressed and activating a different mode of operation

An electronic apparatus includes a first chassis having a heat generating element, a second chassis, a hinge device that connects the first chassis and the second chassis such that the first chassis and the second chassis can be rotated relative to each other between a 0-degree attitude and a 180-degree attitude, and a display provided across the first chassis and the second chassis. The hinge device has a metal hinge main body, a metal first support plate provided to be relatively movable with respect to the inner surface of the first chassis, and a metal second support plate provided to be relatively movable with respect to the inner surface of the second chassis. The electronic apparatus further includes a flexible heat conductive member in the first chassis. The heat conductive member thermally connects a heat receiving member that receives heat from a heat generating element, and the first support plate.

Electronic apparatus

An information processing apparatus includes a processor that can take plural power control modes different in rated power from one another, a fan that rotates to dissipate heat generated by the processor, and a power control unit that controls the power consumption of the processor. The plural power control modes include two or more stages of dynamic control modes different in rated power from one another and a unified communication mode. The power control unit selects any one of the dynamic control modes based on an event in which a power consumption state of the processor continues for a predetermined duration or more, and when the unified communication works, the power control unit preferentially selects the unified communication mode.

An information processing apparatus includes: a first chassis having a first surface provided with at least an air intake port; a second chassis which is connected to the first chassis in a relatively rotatable manner and has a second surface that overlaps the first surface of the first chassis by the rotation; a heat dissipation unit having a fan for replacing air in the first chassis with outside air through at least the air intake port; a state detection unit that detects whether a state is a first state in which the first surface and the second surface overlap; and a control unit which changes control of the fan according to whether the state is the first state.

Systems, apparatus, and methods that control power consumption in a processor are disclosed. One system apparatus, and method includes a processor that operates in at least a first power control mode including a first power amount and a second power control mode including a second power amount lower than the first power amount and a power control device. The power control device is configured to control power consumption in the processor, change a power control mode of the processor to the first power control mode in response to a first excess time period in which the power consumption of the processor exceeds a first reference power for a first period of time, and change the power control mode of the processor to the second power control mode in response to a second period of time in which the power consumption is less than or equal to a second reference power.

Systems, apparatus, and methods for controlling power consumption in an information handling device

A cooling module reduces the number of parts and achieves weight reduction. An electronic apparatus includes: the cooling module; a chassis; first and second heating elements provided inside the chassis; and a cooling module configured to absorb heat generated by the first and second heating elements. The cooling module includes: a vapor chamber in which a sealed space is formed in a portion sandwiched between first and second metal plates and working fluid is sealed in the sealed space, the second metal plate having an outer shape larger than that of the first metal plate; a metal frame formed in a portion of the second metal plate, the portion of the second metal plate protruding from the outer shape of the first metal plate; and a heat conduction plate supported by the metal frame, the heat conduction plate containing graphene.

Cooling module and electronic apparatus

An information processing apparatus includes a first processor that takes plural stages of first power control modes different in first rated power from one another, a second processor that takes plural stages of second power control modes different in second rated power from one another, and a power control unit controls the power consumption of the first processor and the power consumption of the second processor. The power control unit determines a second power control mode based on a first event in which a predetermined state of the first processor continues for a first duration or more, and a second event in which a predetermined state of the second processor continues for a second duration or more.

An electronic apparatus includes: an apparatus chassis including therein an electronic board; a keyboard provided on a top of the apparatus chassis; and a fan device that includes a fan chassis and a blade part. The fan chassis includes a first air intake formed on a bottom surface thereof, a second air intake formed on a top surface thereof, and an air outlet formed on a side surface thereof. The blade part rotates inside the fan chassis. The fan device is arranged between a basal plate and a bottom surface of the keyboard inside the apparatus chassis. The basal plate includes a first inlet at a position overlapping the first air intake. The keyboard includes a second inlet that makes air pass through the keyboard in an up-down direction thereof. The electronic apparatus further includes a first water stop member that separates the first air intake from the electronic board.

Electronic apparatus with fan device

A heat transport device is disclosed. The heat transport device includes a heat pipe and a heat spreader. The heat pipe, which is thermally connecting to a heating element, includes a heat receiving surface for receiving heat from the heating element, and a side surface intersecting with the heat receiving surface. The heat spreader, which is thermally connecting to the heat pipe, includes a first plate member having a first side surface thermally connecting to the side surface of the heat pipe, and a second plate member having a side surface thermally connecting to a second side surface of the first plate member opposite to the first side surface in contact with the heat pipe.

Growing community of inventors

Yokohama, Japan

Takuroh Kamimura