The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Dec. 12, 2022
Applicant:
Lenovo (Singapore) Pte. Ltd., Singapore, SG;
Inventors:
Ryota Watanabe, Kanagawa, JP;
Masahiro Kitamura, Kanagawa, JP;
Mizuki Itoyama, Kanagawa, JP;
Takuroh Kamimura, Kanagawa, JP;
Junrong Zhou, Beijing, CN;
Assignee:
Lenovo (Singapore) Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); G06F 1/206 (2013.01);
Abstract
A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.