Takenori Azuma

Title: Innovations by Takenori Azuma

Introduction

Takenori Azuma is a notable inventor based in Kasukabe, Japan. He has made significant contributions to the field of electronic device packaging. With a total of 2 patents, his work focuses on improving the efficiency and reliability of electronic device packaging.

Latest Patents

One of his latest patents is for a solder coated lid designed for packages containing electronic devices. This innovative lid features a lead-free solder layer made from a Sn–Sb based solder, which has a liquidus temperature of at least 220 degrees Celsius. This design allows the lid to be joined to the base of a package at lower temperatures, minimizing the vaporization of solder components and enhancing adhesion to the electronic devices within the package.

Another significant patent involves a lid for use with a plate-shaped base to seal electronic devices, such as Surface Acoustic Wave (SAW) devices. This lid includes a top portion, a wall structure, and a lip that extends outward from the wall structure. The lip is designed to be soldered to a plate-shaped base, forming a secure package. The manufacturing process for this lid involves drawing a metal strip coated with solder to create a recessed shape, followed by severing a flange to define the lip.

Career Highlights

Takenori Azuma is currently employed at Senju Metal Industry Co., Ltd., where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing the technology used in electronic device packaging, ensuring better performance and reliability.

Collaborations

He has collaborated with notable coworkers, including Sanae Taniguchi and Mitsuo Zen, contributing to various projects and innovations within the company.

Conclusion

Takenori Azuma's contributions to the field of electronic device packaging through his innovative patents demonstrate his commitment to enhancing technology in this area. His work continues to influence the industry positively.