The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2007
Filed:
Jun. 07, 2004
Applicants:
Hideyuki Yoshino, Ube, JP;
Sanae Taniguchi, Minami-Saitama-gun, JP;
Mitsuo Zen, Soka, JP;
Takenori Azuma, Kasukabe, JP;
Inventors:
Hideyuki Yoshino, Ube, JP;
Sanae Taniguchi, Minami-Saitama-gun, JP;
Mitsuo Zen, Soka, JP;
Takenori Azuma, Kasukabe, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.