Senju Metal Industry Co., Ltd.

Takenori Azuma

Mitsuo Zen

Sanae Taniguchi

Hideyuki Yoshino

Masaaki Goto

Fumiaki Nishiuchi

Misao Nakajima

A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn&#x2014;Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.

Solder coated lid

A lid for use with a plate-shaped base to seal an electronic device such as a SAW device includes a top portion, a wall structure extending from the top portion, and a lip connected to the lower end of the wall structure. The lip extends outwards from an outer surface of the wall structure by 10&#x2013;500 &#x3bc;m and has solder on an inner surface thereof. The lid can be soldered to a plate-shaped base to form a package. The lid can be conveniently formed by performing drawing of a metal strip coated with solder to define a recessed shape, and then severing a flange of the recessed shape to define the lip.

Lid for use in packaging an electronic device and method of manufacturing the lid

Growing community of inventors

Kasukabe, Japan

Takenori Azuma