Takashi Nihonmatsu

Title: Takashi Nihonmatsu: Innovator in Semiconductor Processing

Introduction

Takashi Nihonmatsu is a prominent inventor based in Nagano-ken, Japan. He has made significant contributions to the field of semiconductor processing, holding a total of 6 patents. His work focuses on improving the methods and devices used in the manufacturing of semiconductor wafers.

Latest Patents

Nihonmatsu's latest patents include a method for processing semiconductor wafers that involves a series of processes such as chamfering, lapping, etching, and mirror-polishing. This innovative method utilizes acid etching after alkaline etching, employing a specific acid etchant composed of hydrofluoric acid, nitric acid, phosphoric acid, and water. This approach ensures that the semiconductor wafers achieve excellent flatness, surface roughness, and optimal conditions on their back surfaces. Additionally, he has developed a wafer polishing method and device that enhances the flatness of wafers during the polishing process. This method involves vacuum-chucking the wafer to create a convex surface, allowing for improved adhesion and polishing efficiency.

Career Highlights

Nihonmatsu is currently employed at Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. His expertise and innovative approaches have positioned him as a key figure in advancing semiconductor manufacturing technologies.

Collaborations

Throughout his career, Nihonmatsu has collaborated with notable colleagues, including Masahiko Yoshida and Tadahiro Kato. These partnerships have contributed to the development of cutting-edge technologies in the semiconductor field.

Conclusion

Takashi Nihonmatsu's contributions to semiconductor processing through his innovative patents and collaborative efforts highlight his importance in the industry. His work continues to influence the advancement of semiconductor technologies, ensuring better performance and quality in the manufacturing process.