Takashi Ideno

Title: Takashi Ideno - Innovator in Semiconductor Technology

Introduction

Takashi Ideno is a prominent inventor based in Tokyo, Japan, known for his contributions to semiconductor technology. He holds two patents that showcase his innovative approach to improving semiconductor modules and manufacturing processes.

Latest Patents

His latest patents include a semiconductor module and a method for manufacturing the same. This invention enhances the bonding properties between an insulated substrate and a sealing resin. The semiconductor module features an insulated substrate, a circuit pattern formed on the substrate, semiconductor elements joined to the circuit pattern, and a sealing resin that encapsulates these components. Notably, the surface of the insulated substrate is characterized by specific roughness measurements that improve the bonding quality.

Another significant patent involves producing a metal/ceramic circuit board by removing residual silver. This process includes bonding a copper plate to a ceramic substrate using an active metal containing brazing filler metal. The unnecessary portions of the copper plate and the active metal are then removed, followed by chemical polishing to ensure the active metal protrudes from the copper plate's side face.

Career Highlights

Throughout his career, Takashi Ideno has worked with notable companies such as Dowa Metaltech Co., Ltd. and Fuji Electric Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technologies.

Collaborations

Ideno has collaborated with talented individuals in the field,