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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10834823 B1

PDFFull Text
Date of Patent:
Nov. 10, 2020

Filed:

Feb. 08, 2018

Producing metal/ceramic circuit board by removing residual silver

Applicant:

Dowa Metaltech Co., Ltd., Tokyo, JP;

Inventors:

Takashi Ideno, Tokyo, JP;

Ayumu Ozaki, Tokyo, JP;

Koji Kobayashi, Tokyo, JP;

Assignee:

Dowa Metaltech Co., Ltd., Tokyo, JP;

Attorneys:

Bachman and Lapointe PC

George Coury

Primary Examiner:

Erin B Saad

Assistant Examiner:

Carlos J Gamino

Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 1/03 (2006.01); B23K 1/00 (2006.01); H01L 21/48 (2006.01); C04B 37/02 (2006.01); H01L 23/373 (2006.01); H05K 3/06 (2006.01); H05K 3/38 (2006.01); B23K 1/19 (2006.01); B23K 101/42 (2006.01); H05K 3/26 (2006.01); B23K 103/12 (2006.01); B23K 103/00 (2006.01); B23K 103/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/022 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); C04B 37/026 (2013.01); H01L 21/4871 (2013.01); H01L 23/3735 (2013.01); H05K 1/0306 (2013.01); H05K 3/06 (2013.01); H05K 3/38 (2013.01); B23K 2101/42 (2018.08); B23K 2103/12 (2018.08); B23K 2103/18 (2018.08); B23K 2103/52 (2018.08); B23K 2201/42 (2013.01); C04B 2237/12 (2013.01); C04B 2237/124 (2013.01); C04B 2237/125 (2013.01); C04B 2237/127 (2013.01); C04B 2237/341 (2013.01); C04B 2237/343 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/407 (2013.01); C04B 2237/70 (2013.01); H05K 3/067 (2013.01); H05K 3/26 (2013.01); H05K 2201/0769 (2013.01); H05K 2201/09845 (2013.01);
Abstract

After a copper plateis bonded to at least one surface of a ceramic substratevia an active metal containing brazing filler metalwhich contains silver, the unnecessary portion of the copper platand active metal containing brazing filler metalis removed, and thereafter, an unnecessary portion of the copper plateis removed by chemical polishing so as to cause the active metal containing brazing filler metalto protrude from the side face portion of the copper plate, and then, a silver layeradhered to the surface of the copper plateby the chemical polishing is removed.

Find Patent Forward Citations

Ideno, Takashi. (2020). Producing metal/ceramic circuit board by removing residual silver (U.S. Patent No. 10834823). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10834823

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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