The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Feb. 06, 2019
Fuji Electric Co., Ltd., Kawasaki, JP;
Dowa Metaltech Co., Ltd., Tokyo, JP;
Yuhei Nishida, Nagano, JP;
Fumihiko Momose, Nagano, JP;
Takashi Ideno, Tokyo, JP;
Yukihiro Kitamura, Tokyo, JP;
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
DOWA METAL TECH CO., LTD., Tokyo, JP;
Abstract
Provided are a semiconductor module in which bonding properties between an insulated substrate and a sealing resin is improved and a method for manufacturing the semiconductor module. A semiconductor moduleis provided with: an insulated substrate; a circuit patternthat is formed on the insulated substrate; semiconductor elementsthat are joined on the circuit pattern; and a sealing resinfor sealing the insulated substrate, the circuit pattern, and the semiconductor elements. The surfaceof the insulated substrate in a part where the insulative substrate and the sealing resin are bonded to each other, is characterized in that, in a cross section of the insulated substrate, the average roughness derived in a 300-μm wide range is 0.15 μm or greater and the average roughness derived in a 3-μm-wide range is 0.02 μm or greater.