Dowa Metaltech Co., Ltd.

Fuji Electric Co., Ltd.

Takashi Ideno

Koji Kobayashi

Fumihiko Momose

Yuhei Nishida

Ayumu Ozaki

Yukihiro Kitamura

Provided are a semiconductor module in which bonding properties between an insulated substrate and a sealing resin is improved and a method for manufacturing the semiconductor module. A semiconductor moduleis provided with: an insulated substrate; a circuit patternthat is formed on the insulated substrate; semiconductor elementsthat are joined on the circuit pattern; and a sealing resinfor sealing the insulated substrate, the circuit pattern, and the semiconductor elements. The surfaceof the insulated substrate in a part where the insulative substrate and the sealing resin are bonded to each other, is characterized in that, in a cross section of the insulated substrate, the average roughness derived in a 300-&#x3bc;m wide range is 0.15 &#x3bc;m or greater and the average roughness derived in a 3-&#x3bc;m-wide range is 0.02 &#x3bc;m or greater.

Semiconductor module and method for manufacturing same

After a copper plateis bonded to at least one surface of a ceramic substratevia an active metal containing brazing filler metalwhich contains silver, the unnecessary portion of the copper platand active metal containing brazing filler metalis removed, and thereafter, an unnecessary portion of the copper plateis removed by chemical polishing so as to cause the active metal containing brazing filler metalto protrude from the side face portion of the copper plate, and then, a silver layeradhered to the surface of the copper plateby the chemical polishing is removed.

Producing metal/ceramic circuit board by removing residual silver

Growing community of inventors

Tokyo, Japan

Takashi Ideno