Koshigaya, Japan

Takamasa Kase

USPTO Granted Patents = 5 


Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Tokyo, JP (2015)
  • Koshigaya, JP (2019 - 2020)

Company Filing History:


Years Active: 2015-2020

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5 patents (USPTO):Explore Patents

Title: Takamasa Kase: Innovator in Adhesive Technology

Introduction

Takamasa Kase is a notable inventor based in Koshigaya, Japan, recognized for his contributions in the field of adhesive technology. With a total of five patents to his name, Kase has demonstrated an exceptional ability to innovate, particularly in the development of pressure-sensitive adhesive sheets.

Latest Patents

Among his latest inventions, Kase has developed two significant patents related to adhesive sheets. The first patent describes a pressure-sensitive adhesive sheet that includes a resin layer with a unique surface characterized by both concave portions and flat faces. This innovative surface design includes a non-uniform width in the concave portions and maintains a specific area ratio within a designated region. The second patent elaborates on an adhesive production method, focusing on the intricate arrangement of concave and flat faces that contribute to the functionality of the pressure-sensitive adhesive sheet.

Career Highlights

Takamasa Kase has built his career at Lintec Corporation, an esteemed company known for its advanced adhesive products. His inventive work has not only contributed to the company’s product line but has also reinforced Lintec's position in the adhesive industry.

Collaborations

Kase collaborates with talented coworkers, including Kazue Uemura and Kiichiro Kato. Together, they foster a creative environment that stimulates innovation and problem-solving in adhesive technologies.

Conclusion

Takamasa Kase is a distinguished inventor whose patents reflect his commitment to enhancing adhesive technology. His work at Lintec Corporation, combined with collaborative efforts, continues to influence the industry and pave the way for future advancements in adhesive solutions.

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