The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Apr. 02, 2015
Lintec Corporation, Itabashi-ku, JP;
Satoshi Kawada, Koshigaya, JP;
Kiichiro Kato, Saitama, JP;
Kazue Uemura, Tsukubamirai, JP;
Yumiko Amino, Funabashi, JP;
Shigeru Saito, Ina-machi, JP;
Koji Tsuchibuchi, Kashiwa, JP;
Takamasa Kase, Koshigaya, JP;
LINTEC CORPORATION, Itabashi-ku, JP;
Abstract
A pressure sensitive adhesive sheet including, on a substrate or a release material, a resin layer including a resin part (X) containing a resin as a main component, and a particle part (Y) consisting of fine particles and having a surface (α) having pressure sensitive adhesiveness and one or more concave portions. When the surface (α) of the resin layer is adhered to a smooth surface of a light transmissive adherend to give a laminate, the areal ratio (S) of the attached area adhered to the smooth surface to the surface (α) is 10 to 95% at 23° C. and 50% RH, and the area increase rate {[(S−S)/S]×100} is −10 to 20% after heating of the smooth surface by statically leaving the laminate at 80° C. for 30 minutes.