Hsinchu, Taiwan

Tai-Sheng Feng


Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2012-2013

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3 patents (USPTO):Explore Patents

Title: Innovations of Tai-Sheng Feng

Introduction

Tai-Sheng Feng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of circuit manufacturing, holding a total of three patents. His work focuses on advanced manufacturing methods that enhance the efficiency and effectiveness of buried circuit structures.

Latest Patents

One of his latest patents is a manufacturing method for a buried circuit structure. This method includes providing a substrate with at least one trench formed within it. The process involves forming a first conductive layer on the substrate, creating a patterned photoresist, and removing the first conductive layer not covered by the photoresist. This results in a second conductive layer with a top lower than the trench opening. The method continues with the removal of the patterned photoresist, followed by a dry etching process to form a third conductive layer on the trench's sidewalls. Finally, a selective metal chemical vapor deposition is performed to create a metal layer, and a protecting layer is formed to fill the trench on the metal layer. Another patent by Feng also focuses on a similar manufacturing method for a buried circuit structure, emphasizing the importance of selective metal chemical vapor deposition and trench protection.

Career Highlights

Tai-Sheng Feng has worked with prominent companies in the semiconductor industry, including Taiwan Memory Company and United Microelectronics Corporation. His experience in these organizations has allowed him to refine his skills and contribute to innovative technologies in circuit design and manufacturing.

Collaborations

Feng has collaborated with notable colleagues such as Le-Tien Jung and John Hsuan. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Tai-Sheng Feng's contributions to the field of circuit manufacturing are significant and impactful. His innovative patents and collaborations with industry leaders highlight his dedication to advancing technology in this area.

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