The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2012
Filed:
Dec. 18, 2009
Applicants:
John Hsuan, Hsinchu, TW;
Tai-sheng Feng, Hsinchu, TW;
Inventors:
John Hsuan, Hsinchu, TW;
Tai-Sheng Feng, Hsinchu, TW;
Assignee:
United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/60 (2006.01); H01L 21/98 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor chip stack includes a first chip and a second chip. The first chip includes a first circuit formed in the first chip with a first integration density, and the second chip includes a second circuit in the second chip with a second integration density smaller than the first integration density. The first chip further includes at least a through-silicon via formed therein for electrically connecting the first chip and the second chip.