Taeheon Kim

Title: Taeheon Kim - Innovator in Semiconductor Technology

Introduction

Taeheon Kim is a prominent inventor based in Busan, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on enhancing the reliability and efficiency of semiconductor packages.

Latest Patents

One of Taeheon Kim's latest patents is related to a semiconductor package and the method of fabricating the same. This innovation involves stacking semiconductor chips using a thermo-compression bonding (TCB) method, which minimizes defects and increases reliability. The semiconductor package features an interface chip with a first test pad, a bump pad inside the first test pad, and a first through silicon via (TSV) between the first test pad and the bump pad. Additionally, it includes at least one memory chip stacked on the interface chip, which has a second test pad, a dummy pad inside the second test pad, and a second TSV between the second test pad and the dummy pad. An adhesive layer is provided between the interface chip and the memory chip, ensuring that no bump is present on the first and second test pads.

Career Highlights

Taeheon Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packages, making them more reliable and efficient for various applications.

Collaborations

Taeheon Kim collaborates with talented coworkers, including Eunkyul Oh and Yunrae Cho. Their combined expertise contributes to the success of their projects and the advancement of semiconductor technology.

Conclusion

Taeheon Kim is a key figure in the semiconductor industry, with a focus on improving the reliability of semiconductor packages. His innovative patents and contributions to Samsung Electronics Co., Ltd. highlight his importance in this field.