Company Filing History:
1 out of 42 
1 out of 61 Years Active: 2016
Title: Tadayuki Sagawa: Innovator in Solder Ball Technology
Introduction
Tadayuki Sagawa is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of electronic materials, particularly through his innovative work on solder balls.
Latest Patents
Sagawa holds a patent for a solder ball and electronic member that effectively suppresses the generation of voids in joints. This solder ball excels in thermal fatigue properties and provides excellent drop impact resistance. The solder ball is composed of a Sn–Bi type alloy, which includes Sn as the main element, along with specific percentages of Cu, Ni, and Bi. An intermetallic compound of (Cu, Ni)Sn is formed within the Sn–Bi alloy, enhancing its performance in electronic applications.
Career Highlights
Throughout his career, Sagawa has worked with prominent companies such as Nippon Steel & Sumikin Materials Co., Ltd. and Nippon Micrometal Corporation. His experience in these organizations has contributed to his expertise in materials science and electronic components.
Collaborations
Sagawa has collaborated with notable colleagues, including Shinichi Terashima and Takayuki Kobayashi. Their joint efforts have further advanced the development of innovative electronic materials.
Conclusion
Tadayuki Sagawa's contributions to solder ball technology demonstrate his commitment to innovation in the electronics field. His patented work continues to influence the industry, showcasing the importance of advanced materials in modern technology.