The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
May. 12, 2014
Nippon Steel & Sumikin Materials Co., Ltd., Tokyo, JP;
Nippon Micrometal Corporation, Saitama, JP;
Shinichi Terashima, Tokyo, JP;
Takayuki Kobayashi, Tokyo, JP;
Masamoto Tanaka, Tokyo, JP;
Katsuichi Kimura, Saitama, JP;
Tadayuki Sagawa, Saitama, JP;
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD., Tokyo, JP;
NIPPON MICROMETAL CORPORATION, Saitama, JP;
Abstract
A solder ball which suppresses generation of voids in a joint, excels in a thermal fatigue property, and can also obtain a good drop impact resistance property, and an electronic member using the same are provided. The solder ball is formed of a Sn—Bi type alloy containing Sn as a main element, 0.3 to 2.0 mass % of Cu, 0.01 to 0.2 mass % of Ni, and 0.1 to 3.0 mass % of Bi, and an intermetallic compound of (Cu, Ni)Snis formed in the Sn—Bi alloy so that the generation of voids in the joint when being jointed to an electrode is suppressed, a thermal fatigue property is excellent, and a good drop impact resistance property can also be obtained.