Nippon Micrometal Corporation

Nippon Steel & Sumikin Materials Co., Ltd.

Tadayuki Sagawa

Takayuki Kobayashi

Shinichi Terashima

Masamoto Tanaka

Katsuichi Kimura

A solder ball which suppresses generation of voids in a joint, excels in a thermal fatigue property, and can also obtain a good drop impact resistance property, and an electronic member using the same are provided. The solder ball is formed of a Sn&#x2014;Bi type alloy containing Sn as a main element, 0.3 to 2.0 mass % of Cu, 0.01 to 0.2 mass % of Ni, and 0.1 to 3.0 mass % of Bi, and an intermetallic compound of (Cu, Ni)Snis formed in the Sn&#x2014;Bi alloy so that the generation of voids in the joint when being jointed to an electrode is suppressed, a thermal fatigue property is excellent, and a good drop impact resistance property can also be obtained.

Growing community of inventors

Saitama, Japan

Tadayuki Sagawa