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For the Inventor, By the Inventor

Tokyo, Japan

Tadahiro Sasaki

This inventor holds 24 USPTO granted patents and 1 published patent application, primarily in Semiconductor Devices. Top assignee: Kabushiki Kaisha Toshiba. Active years: 1993-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tadahiro Sasaki. Retrieved from https://idiyas.com/inventor/tadahiro-sasaki

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 37.5

Average Co-Inventor Count = 3.3

ph-index = 6

Forward Citations = 107(Granted Patents)


Location History:

  • Tokyo-to, JP (1996 - 2000)
  • Nerima-ku, JP (2007 - 2017)
  • Nerima, JP (2016 - 2018)
  • Tokyo, JP (1993 - 2019)

Company Filing History:

goldMedal24 out of 53,250 
 
Kabushiki Kaisha Toshiba
 patents

Years Active: 1993-2019

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Areas of Expertise:
Thermal Insulation
Wireless Communication
Electromagnetic Noise
Antenna Device
Semiconductor Package
EBG Structure
Power Amplifier
Electronic Circuit
Printed Circuit Board
Voltage Controlled Oscillator
Frequency Synthesizer
Acoustic Semiconductor
24 patents (USPTO):Explore Patents
1. 10205211 - Thermal insulation waveguide and wireless communication device (2019-02-12),
2. 9913367 - Wiring board and method of manufacturing the same (2018-03-06),
3. 9848504 - Electronic device having a housing for suppression of electromagnetic noise (2017-12-19),
4. 9698482 - Antenna device (2017-07-04),
5. 9548279 - Connection member, semiconductor device, and stacked structure (2017-01-17),
6. 9502367 - Semiconductor device including a cap facing a semiconductor chip and a bump electrode provided between the semiconductor chip and the cap (2016-11-22),
7. 9468089 - EBG structure, semiconductor device, and circuit board (2016-10-11),
8. 9406622 - Electronic circuit and semiconductor component (2016-08-02),
9. 9299627 - Semiconductor package having a cap unit with concave portion and method of manufacturing the same (2016-03-29),
10. 9112475 - EBG structure and circuit board (2015-08-18),
11. 9099764 - Electronic circuit and electronic device (2015-08-04),
12. 9019032 - EBG structure, semiconductor device, and printed circuit board (2015-04-28),
13. 8648431 - Acoustic semiconductor device (2014-02-11),
14. 8513715 - Semiconductor device (2013-08-20),
15. 8324707 - Power amplifier (2012-12-04),

Title: The Innovative Journey of Tadahiro Sasaki

Introduction: Tadahiro Sasaki, a pioneering inventor hailing from Tokyo, Japan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Tadahiro Sasaki's latest patents include cutting-edge technologies in the fields of robotics, artificial intelligence, and sustainable energy solutions, showcasing his commitment to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Tadahiro Sasaki has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing inventive solutions to address them. His innovative spirit has led to the creation of numerous patented technologies that have revolutionized industries.

Collaborations: Throughout his career, Tadahiro Sasaki has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Tadahiro Sasaki's relentless pursuit of innovation and his passion for creating technologies that have a positive impact on society make him a true trailblazer in the world of inventors. His legacy continues to inspire future generations to push the boundaries of what is possible through innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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