The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Jan. 28, 2014
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Toshihiko Nagano, Aichi, JP;
Tadahiro Sasaki, Tokyo, JP;
Kazuhide Abe, Kanagawa, JP;
Hiroshi Yamada, Kanagawa, JP;
Kazuhiko Itaya, Kanagawa, JP;
Taihei Nakada, Kanagawa, JP;
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Abstract
A semiconductor package of an embodiment includes: a semiconductor chip having a signal input terminal and a signal output terminal; and a cap unit that is formed on the semiconductor chip. The cap unit includes a concave portion forming a hollow structure between the semiconductor chip and the cap unit, a first through electrode electrically connected to the signal input terminal, and a second through electrode electrically connected to the signal output terminal. Of the inner side surfaces of the concave portion, a first inner side surface and a second inner side surface facing each other are not parallel to each other.