The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
Mar. 09, 2015
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Yutaka Onozuka, Yokohama, JP;
Hiroshi Yamada, Yokohama, JP;
Nobuto Managaki, Kawasaki, JP;
Tadahiro Sasaki, Nerima, JP;
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Abstract
A semiconductor device according to an embodiment includes a semiconductor chip, a cap disposed to face the semiconductor chip, and having a through-hole electrode arranged in a through hole, and a bump electrode provided between the semiconductor chip and the cap, wherein the bump electrode is in a protruding shape connecting the semiconductor chip and the through-hole electrode, and wherein at least a portion of the bump electrode is included in the through-hole electrode, and electrically connected thereto, so that the adhesive performance between the cap and the bump electrode can be increased.