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Hsinchu, Taiwan

Ta-Cheng Lien

This inventor holds 90 USPTO granted patents and 34 published patent applications, primarily in EUV Lithography (CPC class G03F1-24). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ta-Cheng Lien. Retrieved from https://idiyas.com/inventor/ta-cheng-lien

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 90 

% Patents Active = 98.9

Average Co-Inventor Count = 4.4

ph-index = 4

Forward Citations = 144(Granted Patents)

Forward Citations (Not Self Cited) = 91(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Cyonglin Township, Hsinchu County, TW (2014 - 2019)
  • Cyonglin Township, TW (2016 - 2024)
  • Hsinchu County, TW (2017 - 2024)
  • Hsinchu, TW (2022 - 2024)

Company Filing History:

goldMedal87 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2014-2026

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Areas of Expertise:
EUV Masks
Photomask
Lithography
Pellicle Membrane
Optical Assembly
Semiconductor Device
Critical Dimension Control
Nanotube Films
Mask Blanks
Cleaning Method
Fabrication
Magnetic Material
90 patents (USPTO):Explore Patents
1. 12761568 - Enhancing lithography operation for manufacturing semiconductor devices (2026-10-13),
2. 12656676 - Extreme ultraviolet mask and method of manufacturing the same (2026-06-16),
3. 12656671 - Method of manufacturing EUV photo masks (2026-06-16),
4. 12645138 - Multi-layer pellicle membrane (2026-06-02),
5. 12645136 - Extreme ultraviolet mask with capping layer (2026-06-02),
6. 12625425 - Lithography mask (2026-05-12),
7. 12607923 - Mask and method for forming the same (2026-04-21),
8. 12578652 - Photomask and methods for measuring and manufacturing the photomask (2026-03-17),
9. 12578640 - Photosensitive material for photoresist and lithography (2026-03-17),
10. 12578270 - Mask characterization methods (2026-03-17),
11. 12535740 - Interstitial type absorber for extreme ultraviolet mask (2026-01-27),
12. 12523929 - Methods for removing catalyst particles from nanotube films (2026-01-13),
13. 12517424 - Methods to improve mechanical properties of pellicle membrane (2026-01-06),
14. 12517423 - Extreme ultraviolet mask with alloy based absorbers (2026-01-06),
15. 12487519 - Reticle container (2025-12-02),

Title: The Innovative Journey of Ta-Cheng Lien

Introduction:

Ta-Cheng Lien, a pioneering inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents:

Ta-Cheng Lien's most recent patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips for various electronic devices.

Career Highlights:

With a career spanning over two decades, Ta-Cheng Lien has worked tirelessly to push the boundaries of innovation in the tech industry. His work has led to the creation of several patented technologies that have revolutionized the way we interact with electronics.

Collaborations:

Throughout his career, Ta-Cheng Lien has collaborated with leading tech companies and research institutions to further his inventions. His collaborative efforts have resulted in the successful implementation of his groundbreaking ideas in real-world applications.

Conclusion:

Ta-Cheng Lien's relentless pursuit of innovation and his passion for creating technology that enhances our daily lives make him a true visionary in the world of inventors. His contributions continue to shape the future of technology and inspire the next generation of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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