Sung-Chun Hsieh

Title: Innovations by Inventor Sung-Chun Hsieh

Introduction

Sung-Chun Hsieh is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on improving the manufacturing processes and structures of semiconductor devices.

Latest Patents

One of his latest patents is titled "Connection structure for semiconductor devices." This patent relates to an improved connection structure that includes a peanut-shaped opening with a narrow area and one or more wide areas. A conductive plug is used to fill at least partially the peanut-shaped opening, enhancing the performance of semiconductor devices. Another significant patent is "Method of fabricating a bonding pad structure for improving the bonding pad surface quality." This method involves forming a bonding pad on a substrate, applying a passivation layer, and using a sacrificial layer to improve the bonding pad's surface quality.

Career Highlights

Sung-Chun Hsieh has worked with prominent companies in the semiconductor industry, including Worldwide Semiconductor Manufacturing Corporation. His experience in these organizations has allowed him to develop innovative solutions that address critical challenges in semiconductor manufacturing.

Collaborations

Throughout his career, Hsieh has collaborated with talented individuals such as Yung-Tsun Lo and Wen-Yu Ho. These collaborations have contributed to the advancement of semiconductor technologies and have fostered a spirit of innovation in the field.

Conclusion

Sung-Chun Hsieh's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced semiconductor devices.