Sun Jin Son

Title: Innovations by Sun Jin Son

Introduction

Sun Jin Son is a notable inventor based in Phoenix, AZ, who has made significant contributions to the field of semiconductor packaging. With a total of 4 patents to his name, he has demonstrated a commitment to advancing technology in this area.

Latest Patents

One of his latest patents is focused on a conformal shield on a punch quad flat no leads (QFN) semiconductor package. This invention includes a leadframe where the leads are selectively half-etched, allowing for specific leads to be electrically connected to a conformal shield applied to the package body. The conformal shield can connect to the exposed leads or in combination with tie bars of the leadframe. In one embodiment, the outer end portions of the top surfaces of the leads are alternately exposed and non-exposed, with the non-exposed leads featuring a top side half-etch that effectively covers them with the package body.

Career Highlights

Sun Jin Son is currently employed at Amkor Technology, Inc., where he continues to innovate in semiconductor technology. His work has been instrumental in enhancing the performance and reliability of semiconductor packages.

Collaborations

Throughout his career, Sun Jin Son has collaborated with talented individuals such as Terry W. Davis and Sung Jin Kim, contributing to a dynamic and innovative work environment.

Conclusion

Sun Jin Son's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in technology and improve the functionality of semiconductor devices.