The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Feb. 14, 2001
Sung Jin Kim, Seoul, KR;
Sun Jin Son, Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A printed circuit board for a semiconductor package, a semiconductor package, and methods for manufacturing the same are disclosed. One printed circuit board includes a core layer with circuit patterns formed thereon. The circuit patterns do not extend to a periphery of the circuit board. Each circuit pattern includes a bond finger and/or an input/output land. A solder mask is provided over the circuit patterns, except for bond fingers and lands. A first metal layer is plated only on the horizontal outer surface of the bond finger and/or ball land of the respective circuit pattern, and not over the remainder of the circuit pattern. The localized plating of the first metal layer enhances adhesion of the solder mask to the circuit patterns, enhances adhesion of an encapsulant to the bond fingers, and avoids waste of the first metal layer material.