The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2007
Filed:
Nov. 12, 2003
Sung Jin Yang, Gangnam-gu, KR;
Sun Ho Ha, Eunpyeong-gu, KR;
Ki Ho Kim, Gangdong-gu, KR;
Sun Jin Son, Seongbuk-gu, KR;
Sung Jin Yang, Gangnam-gu, KR;
Sun Ho Ha, Eunpyeong-gu, KR;
Ki Ho Kim, Gangdong-gu, KR;
Sun Jin Son, Seongbuk-gu, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor package comprising a die paddle defining multiple corners and opposed first and second surfaces. At least one set of leads extends at least partially about the die paddle in spaced relation thereto. Each of the leads has opposed first and second surfaces. Attached to and extending from one of the corners of the die paddle is at least one tie bar which itself has opposed first and second surfaces and at least one aperture disposed therein and extending between the first and second surfaces thereof. Attached to the first surface of the die paddle is a semiconductor die which is electrically connected to at least one of the leads. A package body at least partially covers the die paddle, the leads, the tie bar and the semiconductor die such that the second surfaces of the leads are exposed in and substantially flush with a common exterior surface of the package body, and a portion of the package body extends through the aperture of the tie bar.