Ki Ho Kim

Title: Ki Ho Kim: Innovator in Semiconductor Packaging

Introduction

Ki Ho Kim is a notable inventor based in Gangdong-gu, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and manufacturing methods.

Latest Patents

One of Ki Ho Kim's key patents is titled "Semiconductor package with chamfered corners and method of manufacturing the same." This patent describes a semiconductor package that includes a die paddle with multiple corners and opposed first and second surfaces. The design features at least one set of leads that extend partially around the die paddle, maintaining a spaced relationship. Each lead has opposed surfaces, and a tie bar is attached to one of the corners of the die paddle. This tie bar includes an aperture that extends between its surfaces. The semiconductor die is electrically connected to the leads and is covered by a package body that ensures the leads are exposed and flush with the exterior surface.

Career Highlights

Ki Ho Kim is currently employed at Amkor Technology, Inc., where he continues to develop innovative solutions in semiconductor packaging. His work has been instrumental in advancing the technology used in this critical area of electronics.

Collaborations

Throughout his career, Ki Ho Kim has collaborated with talented individuals such as Sung Jin Yang and Sun Ho Ha. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Ki Ho Kim's contributions to semiconductor packaging highlight his innovative spirit and dedication to advancing technology. His patent reflects a significant step forward in the design and manufacturing of semiconductor packages.