Sun Goo Lee

Title: Innovations by Sun Goo Lee

Introduction

Sun Goo Lee is a prominent inventor based in Kyounggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of his latest patents is a semiconductor package with an increased number of input and output pins. This invention features a generally planar die paddle that defines multiple peripheral edge segments, including at least two slots formed therein. The design allows for a plurality of first leads segregated into at least two sets, enhancing the overall performance of the semiconductor package. Another notable patent is a semiconductor package exhibiting efficient lead placement. This design allows an integrated circuit die to be bonded to the top surfaces of leads, recapturing surface area on the bottom surface of the semiconductor package. The innovative design includes channels cut into the bottom surface to separate first and second leads, allowing for more efficient fabrication.

Career Highlights

Sun Goo Lee is currently employed at Amkor Technology, Inc., a leading company in semiconductor packaging and testing. His work at Amkor has positioned him as a key player in advancing semiconductor technologies.

Collaborations

He has collaborated with notable coworkers, including Choon Heung Lee and Sang Ho Lee, contributing to various innovative projects within the company.

Conclusion

Sun Goo Lee's contributions to semiconductor technology through his patents and work at Amkor Technology, Inc. highlight his role as an influential inventor in the industry. His innovative designs continue to push the boundaries of semiconductor efficiency and functionality.