The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2004
Filed:
Feb. 28, 2003
Sun Goo Lee, Seoul, KR;
Sang Jae Jang, Seoul, KR;
Choon Heung Lee, Kyounggi-do, KR;
Akito Yoshida, Chandler, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A stackable semiconductor package. The semiconductor package comprises a plurality of first and second leads which are arranged in a generally quadrangular array having one pair of opposed sides defined by the first leads and one pair of opposed sides defined by the second leads. The first and second leads each include opposed, generally planar first and second surfaces, and a third surface which is also disposed in opposed relation to the second surface and positioned between the first and second surfaces. A first semiconductor die is electrically connected to the third surfaces of the first leads, with a second semiconductor die being electrically connected to the third surfaces of the second leads. A package body at least partially encapsulates the first and second leads and the first and second semiconductor dies such that the first and second surfaces of each of the first and second leads are exposed in the package body.