The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2004
Filed:
Apr. 28, 2003
Sang Jae Jang, Seoul, KR;
Sun Goo Lee, Seoul, KR;
Sung Su Park, Seoul, KR;
Sung Soon Park, Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor package has a substrate comprising a resin layer of an approximate planar plate, a cavity passing through the resin layer vertically at a center area thereof, a plurality of electrically conductive patterns formed at a bottom surface of the resin layer, and a conductive plan. An adhesive layer of a predetermined thickness is formed at an upper part of an inside of the cavity. A semiconductor die is positioned inside the cavity of the substrate and has a plurality of bond pads formed at a bottom surface thereof, a bottom surface of the adhesive layer being bonded to a top surface thereof. A plurality of conductive wires for electrically connecting the bond pads of the semiconductor die to the electrically conductive patterns are formed at a bottom surface of the substrate. An encapsulant is used for covering the semiconductor die formed at the lower part of the adhesive layer, the conductive wires and the cavity. A plurality of solder balls are fused to the electrically conductive patterns, which is formed at the bottom surface of the substrate.