Suguru Ogura

Title: Suguru Ogura: Innovator in Substrate Processing Technology

Introduction

Suguru Ogura is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of substrate processing, holding a total of 4 patents. His work focuses on improving the efficiency and effectiveness of substrate processing apparatuses and methods.

Latest Patents

One of Suguru Ogura's latest patents is for a substrate processing apparatus and substrate processing method. This innovative apparatus includes a polisher designed to polish a substrate using a polishing liquid. It also features a first cleaner that utilizes sulfuric acid and hydrogen peroxide water to clean the substrate after polishing. Additionally, a second cleaner is employed to further clean the substrate using a basic chemical liquid and hydrogen peroxide water, followed by a drier that ensures the substrate is thoroughly dried.

Another notable patent involves a polishing apparatus, polishing pad positioning method, and polishing pad. This invention allows for easy positioning and attachment of a polishing pad to a polishing table, preventing the formation of air pockets. The design includes a position guide member that is inserted into a guide hole, facilitating accurate alignment of the polishing pad with the polishing table.

Career Highlights

Suguru Ogura is currently associated with Ebara Corporation, a leading company in the field of semiconductor manufacturing equipment. His work at Ebara has been instrumental in advancing substrate processing technologies, contributing to the company's reputation for innovation and quality.

Collaborations

Throughout his career, Suguru has collaborated with notable colleagues, including Kaoru Hamaura and Hiroomi Torii. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in substrate processing.

Conclusion

Suguru Ogura's contributions to substrate processing technology highlight his role as an influential inventor in the industry. His innovative patents and work at Ebara Corporation continue to shape the future of substrate processing methods.