Ebara Corporation

Suguru Ogura

Kaoru Hamaura

Hiroshi Kojima

Mitsuru Miyazaki

Junji Kunisawa

Katsuhide Watanabe

Soichi Isobe

Takeshi Sakurai

Satoshi Nagai

Hiroomi Torii

Masayoshi Imai

Takeshi Iizumi

Katsuhiko Tokushige

A substrate processing apparatus includes a polisher configured to polish a substrate using a polishing liquid, a first cleaner configured to clean the substrate polished by the polisher using sulfuric acid and hydrogen peroxide water, a second cleaner configured to clean the substrate cleaned by the first cleaner using a basic chemical liquid and hydrogen peroxide water, and a drier configured to dry the substrate cleaned by the second cleaner.

Substrate processing apparatus and substrate processing method

When a polishing pad is attached to a polishing table, the polishing pad can be easily positioned on and attached to the polishing table and air pockets are prevented from forming. As a position guide memberis inserted into a guide holewith an attachment surface of a polishing paddownward, the polishing padis positioned on and attached to a polishing table. At this time, the guide holeof the polishing padis guided by the position guide memberand the polishing padis easily positioned so as to match the upper surface of the polishing tablewith the outer periphery thereof. Then, as release paper is gradually peeled off from a rear surface of the polishing pad, the portion where the release paper is peeled off is attached to the polishing table

Polishing apparatus, polishing pad positioning method, and polishing pad

A dressing apparatus capable of bringing an overall dressing surface of a dresser into uniform sliding contact with a polishing surface of a polishing pad and capable of uniformly dressing the overall polishing surface of the polishing pad is disclosed. The dressing apparatus includes a dresser configured to rub against a polishing surface to dress the polishing surface that is used for polishing a substrate, a dresser shaft that applies a load to the dresser, at least one load-applying device configured to apply a downward load to a part of a peripheral portion of the dresser, and an operation controller configured to control operation of the load-applying device.

Dressing apparatus, polishing apparatus having the dressing apparatus, and polishing method

The present invention relates to a polishing method and apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. A polishing liquid is supplied onto a polishing cloth attached on a turntable, and a semiconductor wafer to be polished is held by a top ring. The turntable and the top ring are rotated, respectively. A surface, to be polished, of the semiconductor wafer held by the top ring is pressed against the polishing cloth on the turntable to polish the semiconductor wafer. When a polished semiconductor wafer held by the top ring is to be removed from the polishing cloth on the turntable, a relative speed of the turntable and the top ring is increased as compared with a relative speed of the turntable and the top ring at a period of polishing.

Polishing method and polishing apparatus

Growing community of inventors

Tokyo, Japan

Suguru Ogura