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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10500691 B1

PDFFull Text
Date of Patent:
Dec. 10, 2019

Filed:

Aug. 28, 2017

Substrate processing apparatus and substrate processing method

Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masayoshi Imai, Tokyo, JP;

Katsuhiko Tokushige, Tokyo, JP;

Suguru Ogura, Tokyo, JP;

Katsuhide Watanabe, Tokyo, JP;

Junji Kunisawa, Tokyo, JP;

Takeshi Iizumi, Tokyo, JP;

Mitsuru Miyazaki, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:

Baker & Hostetler LLP

Primary Examiner:

George B Nguyen

Int. Cl.
CPC ...
B24B 5/35 (2006.01); B08B 3/02 (2006.01); B08B 3/08 (2006.01); B08B 3/10 (2006.01); B24B 57/02 (2006.01); C01B 15/01 (2006.01); C11D 7/34 (2006.01); C11D 11/00 (2006.01);
U.S. Cl.
CPC ...
B24B 5/35 (2013.01); B08B 3/024 (2013.01); B08B 3/08 (2013.01); B08B 3/10 (2013.01); B24B 57/02 (2013.01); C01B 15/01 (2013.01); C11D 7/34 (2013.01); C11D 11/0064 (2013.01);
Abstract

A substrate processing apparatus includes a polisher configured to polish a substrate using a polishing liquid, a first cleaner configured to clean the substrate polished by the polisher using sulfuric acid and hydrogen peroxide water, a second cleaner configured to clean the substrate cleaned by the first cleaner using a basic chemical liquid and hydrogen peroxide water, and a drier configured to dry the substrate cleaned by the second cleaner.

Find Patent Forward Citations

Imai, Masayoshi. (2019). Substrate processing apparatus and substrate processing method (U.S. Patent No. 10500691). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10500691

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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