Portland, OR, United States of America

Steve Joy

This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2001-2002.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 58(Granted Patents)


Company Filing History:


Years Active: 2001-2002

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2 patents (USPTO):Explore Patents

Title: Innovations by Steve Joy in Circuit Board Technology

Introduction

Steve Joy is an accomplished inventor based in Portland, OR (US). He has made significant contributions to the field of circuit board technology, holding a total of 2 patents. His work focuses on improving the quality and efficiency of electronic devices through innovative circuit board designs.

Latest Patents

One of Steve Joy's latest patents is titled "Apparatus and method for improving circuit board solder." This invention addresses the issue of solder migration during solder operations by incorporating a plated through hole that is closed at one end. This design enhances solder joint quality compared to traditional methods. Another notable patent is "Multiple layer printed circuit board having power planes on outer layers." This patent describes a multi-layer printed circuit board that features power planes on outer conductive layers, improving solderability and heat dissipation through strategic placement of plated through vias.

Career Highlights

Steve Joy is currently employed at Intel Corporation, where he continues to innovate in the field of circuit board technology. His work has contributed to advancements in electronic device manufacturing, making them more reliable and efficient.

Collaborations

Steve has collaborated with notable coworkers such as John Thomas Sprietsma and Bryce D Horine, further enhancing the innovative environment at Intel Corporation.

Conclusion

Steve Joy's contributions to circuit board technology through his patents demonstrate his commitment to innovation in the electronics industry. His work not only improves product quality but also paves the way for future advancements in the field.

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