The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2002
Filed:
Apr. 14, 1999
Applicant:
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 ;
U.S. Cl.
CPC ...
H05K 1/16 ;
Abstract
A circuit board includes electrical interconnect mounting pads for mounting electronic devices thereto. Some of the electrical interconnect mounting pads include a plated through hole which traverses through the circuit board. One end of the plated through holes is closed, plugged or covered to prevent migration of solder through the plated through holes during a solder operation. The reduction in solder migration, as a result of plugging the plated through hole, increases solder joint quality over solder joint quality achieved using plated through holes which are not closed at one end.