Stefan Landau

USPTO Granted Patents = 22 (Patent Applications = 3)

Average Co-Inventor Count = 3.8

ph-index = 5

Forward Citations = 71(Granted Patents)

Company Filing History:

21 out of 14,705

Infineon Technologies Ag

Years Active: 2009-2018

where 'Filed Patents' based on already Granted Patents

22 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 10020245 - Laminate electronic device (2018-07-10),

2. 9953952 - Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier (2018-04-24),

3. 9147649 - Multi-chip module (2015-09-29),

4. 9142739 - Method and system for providing a reliable light emitting diode semiconductor device (2015-09-22),

5. 8980687 - Semiconductor device and method of manufacturing thereof (2015-03-17),

6. 8969985 - Semiconductor chip package and method (2015-03-03),

7. 8866302 - Device including two semiconductor chips and manufacturing thereof (2014-10-21),

8. 8836113 - Electronic module (2014-09-16),

9. 8828804 - Semiconductor device and method (2014-09-09),

10. 8687370 - Housing for a chip arrangement and a method for forming a housing (2014-04-01),

11. 8686569 - Die arrangement and method of forming a die arrangement (2014-04-01),

12. 8664043 - Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts (2014-03-04),

13. 8253241 - Electronic module (2012-08-28),

14. 8129225 - Method of manufacturing an integrated circuit module (2012-03-06),

15. 8101463 - Method of manufacturing a semiconductor device (2012-01-24),

Title: Innovator Spotlight: Stefan Landau from Wehrheim, DE

Introduction: Stefan Landau, a talented inventor based in Wehrheim, Germany, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 22 patents, his work showcases a commitment to innovation and advancements in electronic devices.

Latest Patents: Among his latest patents, Stefan has developed a revolutionary method for manufacturing a laminate electronic device. This innovative process involves using a carrier with a defined recess pattern, onto which a semiconductor chip is attached. The first insulating layer is formed over the carrier and the semiconductor chip. After establishing these layers, the carrier is separated into multiple parts along the recess pattern. Furthermore, Stefan's patent includes a semiconductor device that features a sealant layer composed of carbon, which contacts both the chip and the carrier, enhancing the device's durability and efficiency.

Career Highlights: Stefan's professional journey includes prestigious positions at Infineon Technologies AG and Qimonda AG. Throughout his career, he has honed his skills and expertise, becoming a prominent figure in the semiconductor industry. His innovative mindset and dedication have paved the way for numerous developments in electronic manufacturing.

Collaborations: Throughout his career, Stefan has worked alongside talented colleagues, including Joachim Mahler and Henrik Ewe. These collaborations have further stimulated innovation and helped to advance the boundaries of semiconductor technology.

Conclusion: Stefan Landau stands out as a remarkable inventor with a wealth of experience and a solid track record of innovation in the semiconductor field. His contributions continue to shape the landscape of electronic devices, demonstrating the power of creativity and technical expertise in driving progress within the industry.

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3 patents pending:

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Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.