The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Feb. 08, 2012
Ivan Nikitin, Regensburg, DE;
Stefan Landau, Wehrheim, DE;
Joachim Mahler, Regensburg, DE;
Alexander Heinrich, Regensburg, DE;
Ralf Wombacher, Burglengenfeld, DE;
Ivan Nikitin, Regensburg, DE;
Stefan Landau, Wehrheim, DE;
Joachim Mahler, Regensburg, DE;
Alexander Heinrich, Regensburg, DE;
Ralf Wombacher, Burglengenfeld, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of manufacturing a semiconductor device includes providing a transfer foil. A plurality of semiconductor chips is placed on and adhered to the transfer foil. The plurality of semiconductor chips adhered to the transfer foil is placed over a multi-device carrier. Heat is applied to laminate the transfer foil over the multi-device carrier, thereby accommodating the plurality of semiconductor chips between the laminated transfer foil and the multi-device carrier.