Sridhar Narasimhan

Title: Inventor Spotlight: Sridhar Narasimhan

Introduction

Sridhar Narasimhan, an accomplished inventor based in Chandler, AZ, has made significant contributions to the field of microelectronics. With five patents to his name, his innovations have revolutionized the way electronic die packages are designed and constructed.

Latest Patents

Sridhar's latest patents showcase his expertise and forward-thinking in microelectronic systems. One notable invention is a package for a microelectronic die that features a first substrate adjacent to a die's surface, a second substrate, and a heat spreader that ensures efficient thermal management. Another critical patent introduces a compression-based mid-level interconnect microelectronic package. This invention emphasizes the arrangement and coupling of multiple substrates with unique interconnect pitches, optimizing surface area and electrical conductivity.

Career Highlights

Sridhar currently works at Intel Corporation, a leading technology company. His experience and skills in microelectronics design have positioned him as a crucial figure within the company. Over the years, Sridhar has developed a deep understanding of the intricate needs of microelectronic packaging, which has played a pivotal role in his patent developments.

Collaborations

Throughout his career, Sridhar has collaborated with talented colleagues such as Brent M. Roberts and Mihir K. Roy. These partnerships have contributed to the success of various projects at Intel Corporation, enhancing the company's innovation pipeline and strengthening its market position in microelectronic solutions.

Conclusion

With a proven track record of innovation and a commitment to advancing technology in microelectronics, Sridhar Narasimhan stands out as a prominent inventor in his field. His patents not only demonstrate his exceptional technical skills but also provide valuable insights into the future of microelectronic packaging.