Intel Corporation

Sridhar Narasimhan

Mihir K Roy

Brent M Roberts

Sriram Srinivasan

Debendra Mallik

Chia-Pin Chiu

Mathew J Manusharow

Hong Xie

Robert Starkston

Thomas A Boyd

Suzana Prstic

Sriram Sriniyasan

Patrick N Stover

A package for a microelectronic die () includes a first substrate () adjacent to a first surface () of the die, a second substrate () adjacent to the first substrate, and a heat spreader () adjacent to a second surface () of the die. The heat spreader makes contact with both the first substrate and the second substrate.

Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

A microelectronic package includes first substrate () having first surface area () and second substrate () having second surface area (). The first substrate includes first set of interconnects () having first pitch () at first surface () and second set of interconnects () having second pitch () at second surface (). The second substrate is coupled to the first substrate using the second set of interconnects and includes third set of interconnects () having third pitch () and internal electrically conductive layers () connected to each other with microvia (). The first pitch is smaller than the second pitch, the second pitch is smaller than the third pitch, and the first surface area is smaller than the second surface area.

Microelectronic package and method for a compression-based mid-level interconnect

Methods of forming a microelectronic structure are described. Embodiments of those methods include attaching a patch to an interposer, forming at least one interconnect structure above and on a top surface of the interposer; and attaching a flex connector to the at least one interconnect structure.

Patch on interposer through PGA interconnect structures

One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.

Soldering a die to a substrate

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Chandler, AZ, United States of America

Sridhar Narasimhan