The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Dec. 16, 2011
Applicants:
Debendra Mallik, Chandler, AZ (US);
Sridhar Narasimhan, Chandler, AZ (US);
Mathew J. Manusharow, Phoenix, AZ (US);
Thomas A. Boyd, North Plains, OR (US);
Inventors:
Debendra Mallik, Chandler, AZ (US);
Sridhar Narasimhan, Chandler, AZ (US);
Mathew J. Manusharow, Phoenix, AZ (US);
Thomas A. Boyd, North Plains, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 21/50 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 21/50 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 23/49833 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/01327 (2013.01);
Abstract
A package for a microelectronic die () includes a first substrate () adjacent to a first surface () of the die, a second substrate () adjacent to the first substrate, and a heat spreader () adjacent to a second surface () of the die. The heat spreader makes contact with both the first substrate and the second substrate.