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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9478476 B1

PDFFull Text
Date of Patent:
Oct. 25, 2016

Filed:

Dec. 16, 2011

Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

Applicants:

Debendra Mallik, Chandler, AZ (US);

Sridhar Narasimhan, Chandler, AZ (US);

Mathew J. Manusharow, Phoenix, AZ (US);

Thomas A. Boyd, North Plains, OR (US);

Inventors:

Debendra Mallik, Chandler, AZ (US);

Sridhar Narasimhan, Chandler, AZ (US);

Mathew J. Manusharow, Phoenix, AZ (US);

Thomas A. Boyd, North Plains, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Kenneth A. Nelson

Primary Examiner:

William Harriston

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 21/50 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 21/50 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 23/49833 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/01327 (2013.01);
Abstract

A package for a microelectronic die () includes a first substrate () adjacent to a first surface () of the die, a second substrate () adjacent to the first substrate, and a heat spreader () adjacent to a second surface () of the die. The heat spreader makes contact with both the first substrate and the second substrate.

Find Patent Forward Citations

Mallik, Debendra. (2016). Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package (U.S. Patent No. 9478476). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9478476

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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