Chandler, AZ, United States of America

Sri Chaitra Chavali

USPTO Granted Patents = 4 

Average Co-Inventor Count = 5.2

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2020-2023

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4 patents (USPTO):

Title: Sri Chaitra Chavali: Innovator in Electronics Engineering

Introduction

Sri Chaitra Chavali is a prominent inventor based in Chandler, AZ (US). She has made significant contributions to the field of electronics engineering, holding a total of 4 patents. Her innovative work focuses on enhancing the performance and efficiency of electronic components.

Latest Patents

Chavali's latest patents include a "Wideband multi-pin edge connector for radio frequency front end module." This invention features a wide bandwidth signal connector plug, which comprises a plurality of signal pins and ground pins designed for optimal performance. The signal pins have a first thickness, while the ground pins have a greater second thickness, ensuring effective signal integrity.

Another notable patent is the "Interposer package-on-package (PoP) with solder array thermal contacts." This invention involves an electronics package that includes a first package substrate with a die embedded in a mold layer. The design incorporates a thermal interface pad and a plurality of solder balls, which are electrically isolated from the package's circuitry, enhancing thermal management.

Career Highlights

Chavali is currently employed at Intel Corporation, where she continues to push the boundaries of technology. Her work at Intel has allowed her to collaborate with some of the brightest minds in the industry, contributing to groundbreaking advancements in electronics.

Collaborations

Some of her notable coworkers include Siddharth K Alur and Debendra Mallik. Their collaborative efforts have further enriched the innovative environment at Intel Corporation.

Conclusion

Sri Chaitra Chavali is a remarkable inventor whose contributions to electronics engineering are noteworthy. Her patents reflect her commitment to innovation and excellence in the field.

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