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For the Inventor, By the Inventor

Asan, South Korea

Soo-Jae Park

This inventor holds 7 USPTO granted patents and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2016-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Soo-Jae Park. Retrieved from https://idiyas.com/inventor/soo-jae-park

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7 

% Patents Active = 57.1

Average Co-Inventor Count = 1.9

ph-index = 2

Forward Citations = 11(Granted Patents)


Location History:

  • Seongnam-si, JP (2016)
  • Seongnam-si, KR (2016)
  • Asan-si, KR (2018 - 2021)

Company Filing History:

goldMedal7 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2016-2021

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7 patents (USPTO):Explore Patents
1. 10950517 - Printed circuit board and semiconductor package (2021-03-16),
2. 10770384 - Printed circuit board having insulating metal oxide layer covering connection pad (2020-09-08),
3. 10586748 - Printed circuit board and semiconductor package (2020-03-10),
4. 10204869 - Integrated circuit package including shielding between adjacent chips (2019-02-12),
5. 9978693 - Integrated circuit package, method of fabricating the same, and wearable device including integrated circuit package (2018-05-22),
6. 9396979 - Wafer carrier including air filters (2016-07-19),
7. 9368465 - Method of forming bump pad structure having buffer pattern (2016-06-14),

Title: The Innovative Contributions of Soo-Jae Park

Introduction

Soo-Jae Park is a prominent inventor based in Asan, South Korea. He has made significant contributions to the field of electronics, particularly in the development of printed circuit boards and semiconductor packages. With a total of 7 patents to his name, Park continues to push the boundaries of innovation in his industry.

Latest Patents

Among his latest patents, Park has developed a printed circuit board (PCB) that features an insulating layer with an upper surface and a lower surface opposite to the upper surface. This PCB includes a first conductive pattern on the upper surface of the insulating layer, a second conductive pattern on the lower surface, and an aluminum pattern that covers at least a portion of the upper surface of the first conductive pattern. Additionally, he has created a first passivation layer that covers at least a portion of the sides of the first conductive pattern, preventing diffusion into the first conductive pattern. Another notable patent involves a PCB that has an insulating metal oxide layer covering the connection pad. This design includes a first connection pad and a second connection pad, each made of a first metal, with a first pad cover layer that includes an insulating metal oxide having a second metal different from the first metal.

Career Highlights

Soo-Jae Park is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate and develop cutting-edge technologies. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable.

Collaborations

Throughout his career, Park has collaborated with talented individuals such as In-ku Kang and Hee-yeol Kim. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Soo-Jae Park's contributions to the field of electronics through his innovative patents and collaborations highlight his role as a leading inventor. His work at Samsung Electronics Co., Ltd. continues to shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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