The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2016

Filed:

Oct. 15, 2014
Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Soo-Jae Park, Seongnam-si, KR;

Hyun-Suk Chun, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/76841 (2013.01); H01L 21/76877 (2013.01); H01L 21/76895 (2013.01); H01L 2224/11831 (2013.01); H01L 2224/11916 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/3512 (2013.01);
Abstract

The method includes forming an upper layer on a lower layer, forming a metal interconnection in the upper layer, forming a passivation layer exposing a center part of the metal interconnection on the upper layer, forming a buffer pattern exposing the center part of the metal interconnection, and selectively and asymmetrically covering a peripheral region of the metal interconnect and a part of the passivation layer, forming a wrapping pattern covering the buffer pattern and exposing the center part of the metal interconnection on the passivation layer, and forming a pad pattern on the center part of the metal interconnection.


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