The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
May. 25, 2017
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Chan-hee Jeong, Asan-si, KR;
Soo-jae Park, Asan-si, KR;
Young-hoon Kim, Asan-si, KR;
In-ku Kang, Hwaseong-si, KR;
Hee-yeol Kim, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Abstract
An integrated circuit package includes at least one first chip mounted in a first region of a mounting surface of a printed circuit board, a molding unit covering the mounting surface and surrounding the at least one first chip, an electromagnetic shielding film covering a surface of the molding unit and surrounding the at least one first chip, and a second chip mounted in a second region of the mounting surface. The second chip is exposed outside the electromagnetic shielding film and is spaced apart from the printed circuit board, with the molding unit being between the second chip and the printed circuit board.