Asan, South Korea

Hee-yeol Kim

This inventor holds 2 USPTO granted patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2018-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hee-yeol Kim. Retrieved from https://idiyas.com/inventor/hee-yeol-kim-qgp7zz58

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2018-2019

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Hee-yeol Kim

Introduction

Hee-yeol Kim, located in Asan-si, South Korea, is a notable inventor with contributions to the field of integrated circuit packaging. With two patents to his name, Kim's work focuses on enhancing the performance and efficiency of electronic components, particularly in the context of modern technology demands.

Latest Patents

Hee-yeol Kim's latest patents showcase innovative advancements in integrated circuit packaging. The first patent details an integrated circuit package that includes at least one first chip mounted in a region of a printed circuit board. This package features a molding unit that surrounds the first chip and is covered by an electromagnetic shielding film. It also includes a second chip, positioned outside the shielding film and separated from the printed circuit board.

The second patent elaborates on a similar integrated circuit package, including a method for its fabrication. This invention also emphasizes the integration of a molding unit and an electromagnetic shielding film, ensuring the reliability and efficiency of the chips used in various electronic devices. Both patents contribute significantly to advancements in wearable tech and other electronic applications.

Career Highlights

Hee-yeol Kim is currently employed at Samsung Electronics Co., Ltd., a leading enterprise in the field of electronics and technology. His work there has positioned him as an integral player in the development of innovative solutions for complex electronic systems.

Collaborations

Throughout his career, Hee-yeol Kim has worked alongside talented coworkers, including Chan-hee Jeong and Soo-Jae Park. These collaborations have proven fruitful, enabling the team to push the boundaries of innovation in their field and contribute to significant developments in integrated circuit technology.

Conclusion

Hee-yeol Kim's contributions to the world of electronics through his patents in integrated circuit packaging reflect his commitment to advancing technology. His innovative designs aim to improve the performance and efficacy of electronic devices, solidifying his reputation as a distinguished inventor in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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