Hillsboro, OR, United States of America

Sishir Bhowmick

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Intel Corporation. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sishir Bhowmick. Retrieved from https://idiyas.com/inventor/sishir-bhowmick

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Sishir Bhowmick: Integrated Circuit Isolation Inventor

Introduction

Sishir Bhowmick is an inventor based in Hillsboro, Oregon, and works at Intel Corporation. His patent work addresses techniques for improving isolation in integrated circuit devices.

Latest Patents

Bhowmick is named on 1 patent, titled “Isolation in Integrated Circuit Devices.” The patent describes techniques for providing isolation in integrated circuit devices and computing systems. In some embodiments, a protective layer is placed on a structure before additional dielectric material is deposited, and the assembly is treated to form a dielectric layer around the structure.

Career Highlights

Bhowmick’s listed invention concerns semiconductor device fabrication, particularly the formation of dielectric layers that provide isolation within integrated circuits. This work is associated with his role at Intel Corporation.

Collaborations

Sang-Won Park and Dennis G. Hanken are identified as Bhowmick’s coworkers. Their shared professional context at Intel Corporation connects their work to the company’s broader semiconductor research and development environment.

Conclusion

Sishir Bhowmick’s patent on integrated circuit isolation reflects his contribution to semiconductor fabrication techniques through his work at Intel Corporation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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