Intel Corporation

Sishir Bhowmick

Leonard C Pipes

Dennis G Hanken

Sang-Won Park

Disclosed herein are techniques for providing isolation in integrated circuit (IC) devices, as well as IC devices and computing systems that utilize such techniques. In some embodiments, a protective layer may be disposed on a structure in an IC device, prior to deposition of additional dielectric material, and the resulting assembly may be treated to form a dielectric layer around the structure.

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Hillsboro, OR, United States of America

Sishir Bhowmick