Siegfried Kopannia

This inventor holds 11 USPTO granted patents and 4 published patent applications, plus 1 CIPO patent and 7 EPO patents. Top assignee: Henkel Ag & Company, Kgaa. Active years: 1996-2020.

USPTO Granted Patents = 11 (Patent Applications = 4)

% Patents Active = 72.7

CIPO Patents = 1

EPO Patents = 7 (Patent Applications = 10)

Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 176(Granted Patents)

Location History:

Duesseldorf, DE (1996)
Krefeld, DE (1999 - 2020)

Company Filing History:

11 out of 4,534

Henkel Ag & Company, Kgaa

patents

Years Active: 1996-2020

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10689551 - Thermally conductive adhesive (2020-06-23),

2. 10590310 - Electrical debonding of PU hot melt adhesives by use of conductive inks (2020-03-17),

3. 9487686 - Reactive two-component hotmelt adhesive composition (2016-11-08),

4. 8969440 - Composite material containing natural fibers (2015-03-03),

5. 6803400 - Water-swellable hot-melt-type adhesive (2004-10-12),

6. 6767424 - Hot-melt adhesive for glueing DVDs (2004-07-27),

7. 6677394 - Swellable hotmelt adhesive (2004-01-13),

8. 6228456 - Hot-melt adhesive for gluing digital versatile discs (2001-05-08),

9. 5883172 - Polyamide hotmelt adhesive (1999-03-16),

10. 5548027 - Hotmelt adhesive (1996-08-20),

11. 5512625 - Thermoplastic hotmelt adhesive (1996-04-30),

Title: Siegfried Kopannia: Innovator in Adhesive Technologies

Introduction

Siegfried Kopannia is a notable inventor based in Krefeld, Germany. He has made significant contributions to the field of adhesive technologies, holding a total of 11 patents. His work focuses on enhancing the performance and functionality of adhesives, particularly in thermal and electrical applications.

Latest Patents

Kopannia's latest patents include innovative solutions such as a thermally conductive adhesive. This invention relates to hotmelt adhesives that exhibit improved thermal conductivity, which can be utilized in various applications. The adhesive compositions consist of at least one (co)polymer binder combined with different fillers, enhancing their thermal properties. Another significant patent involves the electrical debonding of polyurethane hot melt adhesives using conductive inks. This method allows for the reversible bonding of substrates, where an electrically non-conductive substrate is coated with conductive ink before applying the adhesive. By applying a voltage, the adhesion can be weakened, providing a unique solution for substrate bonding.

Career Highlights

Siegfried Kopannia is currently associated with Henkel AG & Company, KGaA, a leading global company in adhesive technologies. His work at Henkel has allowed him to develop and patent innovative adhesive solutions that address modern challenges in various industries.

Collaborations

Kopannia has collaborated with notable colleagues such as Ruediger Butterbach and Ulrike Maassen. These collaborations have contributed to the advancement of adhesive technologies and the successful development of his patented inventions.

Conclusion

Siegfried Kopannia's contributions to adhesive technologies through his patents demonstrate his innovative spirit and commitment to advancing the field. His work continues to influence the development of new adhesive solutions that meet the demands of modern applications.